How AMD is re-thinking Chiplet Design

Sep 27, 2025Channel
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High Yield
High Yield

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Video Details

Published9 months ago
Duration24:21
Video IDmaH6KZ0YkXU
Languageen
CategoryScience & Technology
PrivacyPublic
Made for KidsNo
Video TypeRegular Video

Performance Metrics

Views246.7K
Likes11.4K
Comments915
Engagement Rate4.97%
Likes per 100 views4.60
Comments per 1K views3.71

Description

Strix Halo Chip Deep-dive with a focus on AMD's next-gen die-to-die fan-out interconnect. How AMD is re-imagining Chiplet Design with ZEN 6. Learn more about the ROG Flow Z13: https://us.asus.click/Z13HY2025 Follow me on X: https://x.com/highyieldYT Follow me on Bsky: https://bsky.app/profile/highyield.bsky.social Become a High Yield Patreon: https://www.patreon.com/user?u=46978634 0:00 Intro 0:44 Strix Halo 2:21 Strix Halo Chip Deep-Dive 5:37 Next-gen ZEN 6 interconnect? 6:34 Strix Halo vs Granit Ridge 7:48 SerDes & Infinity Fabric on Package 11:14 GMI-wide & GMI-narrow 13:48 Next-gen Fan-out die-2-die / TSMC InFO-oS 21:11 Next-gen 3D V-Cache 22:05 From ZEN 2 to ZEN 6

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